SEARCH
ISTC-CC NEWSLETTER
RESEARCH HIGHLIGHTS
Ling Liu's SC13 paper "Large Graph Processing Without the Overhead" featured by HPCwire.
ISTC-CC provides a listing of useful benchmarks for cloud computing.
Another list highlighting Open Source Software Releases.
Second GraphLab workshop should be even bigger than the first! GraphLab is a new programming framework for graph-style data analytics.
ISTC-CC Abstract
Control Principles and On-Chip Circuits for Active Cooling Using Integrated Superlattice-Based Thin-Film Thermoelectric Devices
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Volume 22, Issue 9, September 2014.
Borislav Alexandrov, Owen Sullivan, William J. Song, Sudhakar Yalamanchili, Satish Kumar, Saibal Mukhopadhyay
Georgia Institute of Technology
Superlattice thin-film thermoelectric coolers (TECs) are emerging as a promising technology for hot spot mitigation in microprocessors. This paper studies the prospect of ondemand cooling with advanced TECs integrated at the back of the heat spreader inside a package (integrated TEC). Using thermal compact models of the chip and package with integrated TECs, the control principles for TEC-assisted transient cooling are presented. The control principles are implemented in a 130-nm CMOS process and cosimulated with the thermal system to show their feasibility and energy overheads. The simulation results show potential for extending the time for which a chip and package can sustain a high power load.
FULL PAPER: pdf